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Project Number and Title
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Project Status*
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Committee
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5384 ACH Knowledge Base Articles
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Proj Initiated
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Automated Component Handling Committee
|
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5493 Proposed Knowledge Base Article - Small Components Sticking to Cover Tape
|
Proj Initiated
|
Automated Component Handling Committee
|
|
5484 Review of EIA-960-B Assembly Component Tray - ACT
|
Proposed
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Automated Component Handling Committee
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|
5494 Review of EIA-468-C
|
Proposed
|
Automated Component Handling Committee
|
|
5483 Review of EIA-948 Component Tray for Automated Handling
|
PINS
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Automated Component Handling Committee
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5491 Review of ACH Knowledge Base Articles
|
Proj Initiated
|
Automated Component Handling Committee
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|
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5475 EIA-364-122 Safety Holes Test Procedure for Electrical Connectors
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PINS
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CE-2 Electronic Connector Standards
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5476 IEC Mixed Flowing Gas Project - CE-2
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Proposed
|
CE-2 Electronic Connector Standards
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5485 Revision of EIA-364-34 Ambient Condensation Test Procedure for Electrical Connectors and Sockets
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PINS
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CE-2 Electronic Connector Standards
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5492 Review of 7 Test Procedures (EIA-364-13E, -17C, -25E, -27C, -28F, -56E, -1005)
|
Committee Ballot
|
CE-2 Electronic Connector Standards
|
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5496 Review of 7 Test Procedures (EIA-364-02D, -06C, -23C, -34, -87B, -96A, -114)
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PINS
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CE-2 Electronic Connector Standards
|
|
5497 Review of 6 Test Procedures (EIA-364-09D, -35C, -57A, -78C, -83A, -117)
|
PINS
|
CE-2 Electronic Connector Standards
|
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5479 EIA-364-123 High Temperature Exposure With Contact Loading Test Procedure for Electrical Connectors
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BSR8
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CE-2 Electronic Connector Standards
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5486 Review of 6 Test Procedures
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BSR8
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CE-2 Electronic Connector Standards
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|
549X Proposed new Test Procedure for the effect of de-icing fluid on connectors
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Proposed
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CE-2 Electronic Connector Standards
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|
5502 Proposed revision of EIA-364-G to review humidity levels
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Proposed
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CE-2 Electronic Connector Standards
|
|
54XX Review of EIA-364-10J Fluid Immersion Test Procedure for Electrical Connectors
|
Proposed
|
CE-2 Electronic Connector Standards
|
|
5XXX Review of EIA-364-11C Resistance to Solvents Test Procedure for Electrical Connectors and Sockets
|
Proposed
|
CE-2 Electronic Connector Standards
|
|
5XXX
|
Proposed
|
CE-2 Electronic Connector Standards
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|
|
|
|
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5420 Standardization Handbook of RF Transmission Lines and Fittings
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Proposed
|
CE-2.2 RF Connectors and Rigid Coax Connectors
|
|
5467 Review of EIA-225-A Rigid coaxial transmission lines 50 OHMs
|
Proposed
|
CE-2.2 RF Connectors and Rigid Coax Connectors
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|
5468 Revision of EIA-259-A Rigid coaxial transmission lines and connectors, 75 OHMs
|
Proposed
|
CE-2.2 RF Connectors and Rigid Coax Connectors
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|
|
|
|
|
5233 Resistive Devices Handbook - Rev
|
Draft doc
|
P1 - Resistive Devices
|
|
5464 Review of EIA-887-A Thin Film Resistor Network Specification
|
Proposed
|
P1 - Resistive Devices
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|
5477 Revision of EIA-977 Test Method - Electronic Passive Components Exposure to Atmospheric Sulfur
|
Proposed
|
P1 - Resistive Devices
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|
|
|
|
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EIA-198 Project Review
|
Draft docs
|
P2-1 Ceramic Dielectric Capacitors
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|
5362 - Temperature range used to establish temperature coefficient and operating temperature range
|
Commenting
|
P2-1 Ceramic Dielectric Capacitors
|
|
5404 EIA-198 Parametric Conformance Tests
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Proposed
|
P2-1 Ceramic Dielectric Capacitors
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|
5405 EIA-198 Environmental Performance Tests
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Proposed
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P2-1 Ceramic Dielectric Capacitors
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5406 EIA-198 Physical Performance Tests
|
Proposed
|
P2-1 Ceramic Dielectric Capacitors
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|
5409 EIA-198-1-G Ceramic Dielectric Capacitors Classes I, II, III and IV - Part I: Characteristics and Requirements
|
Proposed
|
P2-1 Ceramic Dielectric Capacitors
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5426 Review of IS-692 Ceramic Capacitor Qualification Specification
|
Proposed
|
P2-1 Ceramic Dielectric Capacitors
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|
5427 Revision of EIA-521-A Application Guide for Multilayer Ceramic Capacitors - Electrical
|
Proposed
|
P2-1 Ceramic Dielectric Capacitors
|
|
5471 Revision of EIA-198-3-E Ceramic Dielectric Capacitors Classes I, II, III and IV Part III: Individual Specifications
|
Proposed
|
P2-1 Ceramic Dielectric Capacitors
|
|
5495 Review of EIA-469-E Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors
|
Proposed
|
P2-1 Ceramic Dielectric Capacitors
|
|
5481 Review of EIA-198-3-10 Multilayer (Monolithic), Unencapsulated, Ceramic Dielectric, Surface-Mount Low Induction Chip Capacitors and Multi-Terminal Low Induction Capacitors
|
BSR8
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P2-1 Ceramic Dielectric Capacitors
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|
|
|
|
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5424 Update EIA-809 Solid Tantalum Capacitor Application Guideline
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Proposed
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P2-5 Solid Electrolytic Capacitors (Tantalum, Niobium, Aluminum)
|
|
5425 Review of EIA-717-A Surface Mount Tantalum Capacitor Qualification Specification
|
Proposed
|
P2-5 Solid Electrolytic Capacitors (Tantalum, Niobium, Aluminum)
|
|
5456 Review of EIA-456-A Metallized Film Dielectric Capacitors for Alternating Current Application
|
BSR8
|
P2-5 Solid Electrolytic Capacitors (Tantalum, Niobium, Aluminum)
|
|
5466 Review of EIA-757-A Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacitors
|
BSR8
|
P2-5 Solid Electrolytic Capacitors (Tantalum, Niobium, Aluminum)
|
|
5482 National Adoption of 10 IEC documents
|
Proposed
|
P2-5 Solid Electrolytic Capacitors (Tantalum, Niobium, Aluminum)
|
|
5488 National Adoption of 5 IEC documents
|
Proposed
|
P2-5 Solid Electrolytic Capacitors (Tantalum, Niobium, Aluminum)
|
|
5489 Reaffirmation of EIA 60384-4
|
Proposed
|
P2-5 Solid Electrolytic Capacitors (Tantalum, Niobium, Aluminum)
|
|
|
|
|
|
5444 Review of J-STD-48
|
Proposed
|
S1 Steering Committee
|
|
5480 Rev of JS709
|
Commenting
|
S1 Steering Committee
|
|
|
|
|
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5450 Rev of J-STD-002E Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
|
Proposed
|
STC - Soldering Technology Committee
|
|
|
|
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*Project Status Key
Proposed – Project opened
PINS – Project Initiation form submitted to ANSI
Committee Ballot – informal ballot to collect comments/determine Reaffirmation or Revision
BSR-8 – mandatory Public Review period (45 days)
Commenting – comment collection on circulated document
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